Tungsten

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Material Composition of Tungsten Cemented Carbide Balls 73

As the name suggests, tungsten cemented carbide balls are primarily made of cemented carbide. Cemented carbide is not a single metal, but rather a composite material composed of high-hardness, high-melting-point metal carbides and a metal binder, manufactured through a powder metallurgy process. Its core composition can be summarized as a “two-phase structure”: 1. Hard Phase – Carbide This is the core component that provides ultra-high hardness and wear resistance, typically comprising 70% to 97% of the total composition. 1. Tungsten…

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Materials for Tungsten Cemented Carbide Balls 25

I. Main Materials for Tungsten Cemented Carbide Balls 1. Tungsten Carbide (WC): This is the primary component of tungsten cemented carbide balls. It possesses extremely high hardness and wear resistance, and serves as the core material providing the ball’s strength. 2. Binder (usually cobalt or nickel): Cobalt (Co): The most commonly used binder, used to bind tungsten carbide particles together and enhance the material’s toughness. The cobalt content typically ranges from 6% to 20%, depending on the application. Nickel (Ni):…

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Surface Quality Inspection Methods for Tungsten Cemented Carbide Balls 19

Due to their high hardness, wear resistance, and excellent mechanical properties, tungsten cemented carbide balls are widely used in precision bearings, valve seals, and measuring instruments. Their surface quality directly impacts service life, sealing performance, and operating accuracy, making surface quality inspection a critical step in production and application. Surface quality inspection primarily focuses on defects (such as cracks, pits, scratches, and pores), roughness, uniformity, and residual stress. The following introduces several commonly used inspection methods, combining traditional techniques with…

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Tungsten Carbide Balls Quality Control 23

Quality control of tungsten carbide balls is critical to ensuring their performance meets application requirements. This requires comprehensive management from raw materials and production processes to finished product testing, combining advanced testing methods with rigorous process monitoring to ensure stable product performance. 1. Raw Material Control Powder Quality: Tungsten carbide balls are primarily composed of tungsten carbide (WC) and a binder (such as Co and Ni). The raw material purity, particle size, and chemical composition are strictly controlled to ensure…

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Tungsten Alloy Discs: A Regulating Material in the Counterweight Field 28

Tungsten alloy discs, leveraging their exceptional mechanical, thermal, and chemical properties, have become a critical high-performance material in the counterweight field. CTIA GROUP LTD tungsten alloy discs primarily consist of tungsten as the core component, supplemented with elements such as nickel, iron, and copper, and are manufactured through powder metallurgy processes. They are widely applied across various scenarios, from precision instruments to heavy equipment. I. Performance Advantages of Tungsten Alloy Discs The performance advantages of CTIA GROUP LTD tungsten alloy…

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Performance Comparison of Tungsten and Titanium Targets 35

In the fields of thin film deposition and semiconductor manufacturing, the choice of target material plays a crucial role in process stability and product quality. Titanium and tungsten targets, as two commonly used sputtering materials, each offer distinct advantages in different application scenarios due to their unique physical and chemical properties. Titanium targets, with their excellent corrosion resistance and biocompatibility, are widely used in the thin film preparation for medical, aerospace, and industrial coatings. Titanium can form a stable oxide…

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Performance Comparison of Tungsten and Aluminum Targets 29

In the fields of thin film deposition and semiconductor manufacturing, the choice of target material is crucial for process efficiency and product quality. Aluminum and tungsten targets, as two commonly used materials in sputtering processes, have distinct application focuses due to differences in their physical and chemical properties. Aluminum targets, due to their lightweight nature, low cost, and high electrical conductivity, are widely used in optical coatings, decorative coatings, and thin film preparation for certain electronic devices. In display panels,…

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Performance Comparison of Tungsten and Copper Targets 35

In the fields of semiconductor manufacturing and thin film deposition, the choice of target material significantly impacts process efficiency and product quality. Copper and tungsten targets, as two common sputtering targets, each have distinct advantages and disadvantages in terms of physical properties, chemical stability, and application scenarios. Copper targets, due to their excellent electrical conductivity and relatively low cost, are widely used in the semiconductor industry for depositing interconnect layers. Copper’s high conductivity makes it an ideal choice for preparing…

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Performance Comparison of Tungsten and Molybdenum Targets 27

In the fields of thin film deposition and advanced manufacturing, the choice of target material significantly impacts process efficiency and product quality. Molybdenum and tungsten targets, as refractory metal targets, are widely used in the production of solar cells, display panels, and high-temperature coatings due to their high melting points and chemical stability. Molybdenum targets excel in various sputtering processes due to their high melting point and good electrical conductivity, making them suitable for depositing back electrodes in solar cells…

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Comparison of Tungsten Targets with Other Targets 35

Compared to copper, aluminum, titanium, and molybdenum targets, tungsten targets exhibit significant advantages in high-temperature resistance, high density, chemical stability, mechanical strength, and thin film quality. Their stable performance in high-temperature, high-corrosion, and high-precision sputtering processes makes them the preferred material in semiconductors, medical devices, new energy, and optical coating fields. 1.Comparison with Copper Targets Copper targets, due to their excellent electrical conductivity and lower cost, are widely used for depositing interconnect layers in semiconductors. However, copper’s low melting point…

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